MICROMAX

Micromax™ ME902

Item number: DPME9020-100G

A silver-filled, conductive, solvent-based conductive adhesive used to attach components to printed circuitry in formable/moldable electronic applications

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material notes

Micromax™ ME902 (formerly known as DuPont™ ME902) is a stencil printable/dispensable one part solvent-based conductive adhesive used to attach components to printed circuitry that can be later formed and over molded to produce an in-mold electronic component. The adhesive has robust adhesion necessary to withstand the forming process and the elevated temperatures used with injection molding processes with minimal change in performance. This formulation possesses excellent adhesion and compatibility when used directly on polycarbonate substrates, treated polyester, and graphic inks. Effective drying can be achieved at 120°C for 20 minutes. Thermoforming can be achieved using temperatures of 160°C with elongation >50%. FOR REFERENCE ONLY

Key Properties

adhesion -
1000-1200 grams-force shear strength 1206 size SMD LEDs on DuPont silver

coverage -
N/A

flexibility -
0

operating temp -
N/A

viscosity pa -
40-90 Pa∙s

volume resistivity -
100-150 mohms/sq/mil [serpentine pattern, 14μm thickness]