Micromax™ QP165

Item number: DPQP1650-250G

A screen printable copper conductive ink that is fired in nitrogen providing excellent solderability

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material notes

Micromax™ QP165 (formerly known as DuPont™ QP165) is a copper conductive ink that can be applied to a multilayer PWB via screenprinting. This ink is formulated to be fired as a coverprint over other coppers when solderability is needed. This product is not recommended as a standalone coverprint over other layers or directly onto ceramic. It can be applied using a 325SS mesh screen and allowed to dry at room temperature for 10-15 minutes followed by drying at 120°C for 10-15 minutes in a nitrogen atmosphere, then fired for 55 minutes in a nitrogen atmospheres, <10ppm O₂, with a soak for 10 minutes at 900°C. This product can be thinned with Micromax™ 9450. FOR REFERENCE ONLY

Key Properties

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